News

Taiyo Nippon Sanso is Proud to Sponsor the 15th International Conference on Nitride Semiconductors (ICNS-15) in Malmö, Sweden from July 6 (Sun) to 11 (Fri), 2025.
Oral Presentation
●Booth No.: 20
●Topic: Advanced High-Flow-Velocity Horizontal MOCVD Technology for Nitride Semiconductor Growth

coming soon

Innovation Unit, CSE Department will move from Shiba Office to Minatomirai Office. Business will resume on May 1.

Taiyo Nippon Sanso sponsored, and also exhibited at, IWN 2022 in Berlin, Germany from October 9 (Sun) to 14 (Fri), 2022 and IWGO 2022 in Nagano prefecture from October 23 (Sun) to 27 (Thu). (English translation of TNSC house journal, January 2023)

Taiyo Nippon Sanso is becoming a Gold Sponsor for the Harold M. Manasevit Young Investigator Award, which recognises seminal contributions in MOCVD technology and research.

We have begun epitaxy using the newly-developed FR2000-OX Ga2O3 MOCVD system.

Taiyo Nippon Sanso plans to have a booth at the 11th Topical Workshop on Heterostructure Microelectronics (TWHM) from August 23 to 26, 2015 at Hida Hotel Plaza in Takayama, Japan.
It is also planning to participate in the poster session on the topic of "Correlation of initial AlN layer and vertical direction current leakage of AlGaN/GaN high-electron-mobility transistors (HEMTs) on Si substances". 

Taiyo Nippon Sanso plans to have a booth at the 11th International Conference on Nitride Semiconductors (ICNS-11) from August 30 to September 4, 2015 at the Beijing International Convention Center in Beijing, China.

Taiyo Nippon Sanso plans to have a booth at LED Taiwan 2015 from March 25 to 28, 2015 at the TWTC Nangang Exhibit Hall in Taipei, Taiwan.

Taiyo Nippon Sanso plans to have a booth at IWN 2014 (International Workshop on Nitride Semiconductors 2014) from August 24 to 29, 2014 at the Centennial Hall in Wroclaw, Poland.

Taiyo Nippon Sanso will be holding a booth at the 5th International Symposium on Growth of Ⅲ-Nitrides (ISGN-5) at the Westin Hotel, Peachtree Plaza (Atlanta, Georgia) from May 18 to 22, 2014.

Taiyo Nippon Sanso will have a booth at "LED Taiwan 2014," to be held at TWTC Nangang Exhibit Hall, Taiwan from March 20 to 23, 2014.

Taiyo Nippon Sanso plans to have a booth at SEMICON Taiwan 2013 from September 4 to 6, 2013 at TWTC Nangang Exhibition Hall, Taiwan.

Taiyo Nippon Sanso is planning both a booth and a presentation on the epi-results of its MOCVD systems during the poster session at ICNS-10 (10th International Conference on Nitride Semiconductors) from August 25 to 30, 2013 at Gaylord National Hotel and Convention Center, Washington.
TNSC poster session presentation: August 28, 2013 

Taiyo Nippon Sanso plans to have a booth at TWHM 2013 (10th Topical Workshop on Heterostructure Microelectronics) from September 2 to 5, 2013 at Hakodate Kokusai Hotel.

coming soon

Characteristics of AlN Layer on 4 inch Sapphire Substrate by High Temperature Annealing in Nitrogen Atmosphere

Influence of the Al content of the AlGaN buffer layer in AlGaN/GaN high-electron-mobility transistor structures on a Si substrate

Impact of crystal quality of AlN nucleation layer on the vertical direction breakdown voltage of AlGaN/GaN high-electron-mobility transistor structures on Si

Regrowth of High-Al-content AlGaN and AlN on High-quality AlN Template Fabricated by Annealing at 1700 ℃ under Nitrogen Ambient

Study of carbon concentration in GaN grown by metalorganic chemical vapor deposition

High quality Al0.6Ga0.4N and AlN growth on AlN template with a high temperature annealing in N2 ambience

Challenge and Opportunity of high-flow rate MOCVD tool for UV-LED Application

Characterization of AlN and Mg-doped AlxGa1-xN(x>0.2) Grown by Using Horizontal High-flow-rate MOVPE System 2016 ICMOVPE

Improvement of Crystalline Quality of AlN and High-Al-content AlGaN at High Growth Rate Using Horizontal High-flow-rate MOVPE System CSW 2016

Relationship between Al content of AlGaN buffer layer on top of initial AlN nucleation layer on Si and vertical leakage current of AlGaN/GaN highelectron-mobility transistor structures CSW 2016

GROWTH OF N-TYPE AlxGa1-xN (x>0.5) WITH LOW ELECTRIC RESISTIVITY AT HIGH V/III RATIO IWUMD 2016

Effect of the formation temperature of the AlN/Si interface on the vertical-direction breakdown voltages of AlGaN/GaN HEMTs on Si substrates MRS Advances

Variation of vertical direction breakdown voltage of the AlGaN/GaN HEMTs on AlN/Si template substrate as a function of growth temperature of initial Al layer MRS2016 spring meeting (Poster Session)

Breakdown electric field of each layer in AlGaN/GaN high-electron-mobility transistors on Si substrates Isplasma 2016

Correlation of the initial AlN layer and vertical direction current leakage of AlGaN/GaN high-electron-mobility transistors (HEMTs) on Si substances
Advance copy for the 11th Topical Workshop on Heterostructure Microelectronics (Poster Session)